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| Base material | FR4,High-TG FR4,CEM3,aluminum, High Frequencey frequency(Rogers,Taconic,Aron,PTFE,F4B) |
| Layers | 1-4 Layers(Alunimum), 1-32 layers(FR4) |
| Copper Thickness | 0.5oz, 1oz, 2oz, 3oz,4oz |
| Dielectric Thickness | 0.05mm, 0.075mm, 0.1mm,0.15mm,0.2mm |
| board Core Thickness | 0.4mm,0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm and 3.2mm |
| Board Thickness | 0.4mm - 4.0mm |
| Thickness Tolerance | +/-10% |
| Aluminum Machining | Drilling, Tapping, Milling, Routing, Die-Punching, Break-off tab available |
| Min Hole | 0.2 mm |
| Min Track Width | 0.2mm (8mil) |
| Min Track Gap | 0.2mm (8mil) |
| Min SMD Pad Pitch | 0.2mm (8mil) |
| Surface Finishing | HASL lead free,ENIG,Plated Gold,Immersion Gold,OSP |
| Solder Mask Color | Green, Blue, Black, White, Yellow, Red, Matt Green, Matt Black, Matt Blue |
| Legend Color | Black, White etc |
| Assembly Types | Surface mount Thro-hole Mixed technology (SMT & Thru-hole) Single or double sided placement Conformal coating Shield cover assembly for EMI emission control |
| Parts Procurement | Full Turnkey Partial Turnkey Kitted/Consigned |
| Component types | SMT 01005 or larger BGA 0.4mm pitch, POP (Package on Package) WLCSP 0.35mm pitch Hard metric connectors Cable & wire |
| SMT Parts Presentation | Bulk Cut tape Partial reel Reel Tube Tray |
| Stencils | Laser-cut stainless steel |
| Other Techniques | Free DFM Review Box Build Assembly 100% AOI test and X-ray test for BGA IC programming Components cost-down Function test as custom Protection technology |



















| | Sample Lead time | Mass production lead time | ||
| Single sided PCB | 1~3 days | 4~7 days | ||
| Double sided PCB | 2~5 days | 7~10 days | ||
| Multilayer PCB | 7~8 days | 10~15 days | ||
| PCB Assembly | 8~15 days | 2~4 weeks | ||
| Delivery time | 3-7 days | 3-7 days | ||
| Package: Anti-static Package with carton | | | ||
